先进MEMS制造技术

摘要：

@@ 1 IntroductionMEMS technology is facing new challengessince thin wafer handling will be used more andmore to archive smaller dies.Packaging the next device on the top of the first and so on called packageon package (POP), first to reduce the wire bondingas the connections will be via through vias that runthrough the bulk silicon and second the size of thesecond (third, fourth…)can have the same size ofthe first one.All that means more space for the Diebut less additional work to connect the Dies to eachother.Perhaps the most significant is the substantially larger market size and the drive toward lowercosts.

机标关键词：MEMS制造技术、Manufacturing Technology、significant、technology、means、work、thin、via、POP、new

所属期刊栏目：40

分类号：TN305(半导体技术)

在线出版日期：2011-07-19（万方平台首次上网日期，不代表论文的发表时间）

页数：共3页

页码：43-45