公司与新品介绍

摘要：

@@ SHANGHAI,CHINA / ST. FLORIAN, AUS-TRIA, March 17, 2009 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduces the NT series - a new, yet al-ready field-proven suite of mask aligners, wafer-to-wafer (W2W) bond aligners and measure-ment systems -- to address increased demand for high-er precision alignment accuracy.

机标关键词：wafer bonding、alignment、SHANGHAI、suite、CHINA、MEMS、new

所属期刊栏目：38

分类号：TN3;TB3

在线出版日期：2009-05-05（万方平台首次上网日期，不代表论文的发表时间）

页数：共2页

页码：55-56