The Evolution of Wafer Bonding Moving from the back-end further to the front-end

摘要：

@@ 1 IntroductionAs the nanoscale era progresses, innovative new materials and processes continue to be developed and implemented as a means of keeping the industry on the path of Moore”s Law. Wafer bonding - literally, the temporary or permanent joining of two wafers or substrates using a suitable combination of process technologies, chemicals and adhesives - is one such innovation.

机标关键词：Wafer bonding、combination、processes、materials、means、two、new、era

所属期刊栏目：38

分类号：TN3;TB3

在线出版日期：2009-05-05（万方平台首次上网日期，不代表论文的发表时间）

页数：共7页

页码：20-26