Preface to Special Issue on Electronic Electroplating

摘要：

Electroplating is a process using electric current to deposit a layer of metal(s),which is an indispensable technique in the manufacture of integrated circuits and micro-nano electronic devices.Electroplating for modern electronics is much smaller in scale than the ordinary electroplating processes and relies heavily on foreign technique,such as proprietary materials and equipment.As the competition in the field of chip manufacture intensifies,we realize that there is no choice but to become self-sufficient in such tech-nology,including,but not limited to electroplating technology.

机标关键词：electronic、electroplating、issue、preface、special

所属期刊栏目：28

分类号：F371

在线出版日期：2022-09-28（万方平台首次上网日期，不代表论文的发表时间）

页数：共3页

页码：1-3