Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration

机标关键词：thermal conductivity、high temperature

所属期刊栏目：20

资助基金：This work was financially supported by the National Natural Science Foundation of China50971020;the National High-Tech Research and Development Program of China2008AA03Z505

在线出版日期：2013-04-15（万方平台首次上网日期，不代表论文的发表时间）

页数：共7页

页码：180-186